Title
Foundation of Mathematical Deterioration Models for the Thermal Stress

Authors
Hideo Hirose and Takenori Sakumura

Source
IEEE Trans., Dielectrics and Electrical Insulation, Vol. 22, Issue 1, pp. 482-487, February 2015. DOI: 10.1109/TDEI.2014.004450

Abstract

We construct mathematical models to represent the relationship between the thermal stress and the deterioration rate for electrical insulation. The Arrhenius-log-normal model has been used generally for such a deterioration model due to the thermal stress. The Arrhenius law is based on the chemical reaction theory between the absolute tem- perature and the activity of materials. On the other hand, as for the log-normal distri- bution, we have been only followed the traditional statistical treatment such that the de- terioration could be represented by the normal distribution when logarithmic time is used. The Arrhenius-log-normal model is a combination of these two models. However, in the International Electrotechnical Commission 60216-1, deterioration due to the thermal stress is represented by the mechanical strength, and the time showing 50% mechanical strength to the initial strength is defined as the failure time. We assume here the generalized Pareto distribution model, the generalized logistic distribution model, or the normal distribution model for such a model. Thus, in this paper, we con- struct new mathematical models combined by the Arrhenius law with the generalized Pareto distribution model, the generalized logistic distribution model, or the normal distribution model.


Key Words
thermal deterioration, Arrhenius law, generalized Pareto distribu- tion, generalized logistic distribution, log-normal distribution, ordinary differential equation, growth curve, maximum likelihood estimation method, method of least squares.

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